Crystal Ion Slicing (CIS)

CIS (Crystal ion slicing) is a novel technology to fabricate mesoscopically thin films. Utilizing recent ion implantation engineering, a sacrificial layer is introduced into a bulk material at controled depth. Either wet etching or thermal treatment can slice a thin film from the bulk.


Lithium Niobate Film
Crystal Ion Slicing1
YIG under slicing process
Crystal Ion Slicing2

 

  • Single-crystal thin films
  • Thickness available from 0.5 micron to ~10 microns
  • Wide range of materials

  1. Mechanism
  2. Materials
  3. Applications
  4. Publications