Crystal Ion Slicing (CIS)
CIS (Crystal ion slicing) is a novel technology to fabricate mesoscopically thin films. Utilizing recent ion implantation engineering, a sacrificial layer is introduced into a bulk material at controled depth. Either wet etching or thermal treatment can slice a thin film from the bulk.
- Single-crystal thin films
- Thickness available from 0.5 micron to ~10 microns
- Wide range of materials